Beru Thick Film Hybrid Microcircuits

Here at Globec UK Ltd. we specialise in the distribution of EMC/Lighting Suppression and Hybrid Microcircuit Components.

One of the products we offer is Beru Microelectronica Thick Film Hybrid Microcircuits, low cost products designed to be used in a variety of applications.

Capabilites include:

Thick Film Technology – conductors, resistors, capacitors and inductors produced directly onto the substrate.

SMD Technology – highly automated assembly of descrete, active and passive components

Chip & Wire Technology – bonding of raw die to the substrate using wire bonding techniques suitable for use in hermetically sealed packages.

Chip-on-Board (CoB) Technology – the art of epoxy sealing raw die onto an open substrates (PCB or Alumina) to protect against the effects of shock and light.

MultiChip Modules – the technology of building up electronic modules which using multiple chips as the building blocks

To discuss your requirements, please call a member of our friendly, knowledgeable team.

For more information click on our Trade Link.